Letoto le lecha le tla ka liphetolelo tse supileng, tse nang le matla a matla pakeng tsa 560 W le 590 W. Matla a ho fetola matla a pakeng tsa 21.7% le 22.8%

Sechaenamotlakase oa letsatsimoetsi oa Longi o senotse bekeng ena mojule oa eona o mocha oa Hi-Mo 7 PV bakeng sa lits'ebetso tse kholo le tsa C&I ho SNEC tradeshow e Shanghai, China.

Moetsi o itse sehlahisoa se secha se ipapisitse le lisele tsa tunnel oxide passivated contact (TOPCon), li-wafers tsa M10 le theknoloji e phahameng ea ts'ebetso ea hybrid passivity (HPDC) dual junction technology.

Khamphani e hlalositse: "Ka morao ho sele ho na le likhokahano tse phahameng le tse tlase, moralo o ntlafalitsoeng oa lifilimi, le mekhoa e tsoetseng pele ea ho beha lintho ho fihlela sebaka se makatsang sa ho monya likokoana-hloko."Ka lehlakoreng le ka pele, sele e sebelisoa ka lera la sebaka sa heno le hanyetsanang le matla le ntlafatsang ts'ebetso ea lisele.Ntle le moo, mahlakore a ka pele le a ka morao a kenyelletsa lifilimi tse ntlafalitsoeng tsa antireflection le tse tlase, hammoho le tharollo ea metallization bakeng sa ts'ebetso e phahameng. "

Sehlahisoa se secha se lekanya 2,278 mm x 1,134 mm x 30 mm mme se na le boima ba 31.8 kg.E na le likhalase tse peli tsa 2.0 mm, foreimi ea aluminium ea anodized, le litekanyetso tsa IP68.Thempereichara ea mocheso ke -0.28% ho C.

Letoto le lecha le tla ka liphetolelo tse supileng, tse nang le matla a matla pakeng tsa 560 W le 590 W. Matla a ho fetola matla a matla a pakeng tsa 21.7% le 22.8%.Matla a motlakase a bulehileng a tloha ho 50.89 V ho ea ho 51.63 V 'me motlakase oa nakoana o pakeng tsa 13.89 A le 14.1 38.

Thediphanelee ka sebelisoa mekhoeng ea PV e nang le matla a phahameng a 1,500 V. Khampani e fana ka tiiso ea sehlahisoa sa lilemo tse 12 le tiiso ea lilemo tse 30 tsa tlhahiso ea matla bakeng sa 88.18% ea lihlahisoa tsa pele.

"Litekanyetso tsa potoloho ea bophelo ba lihlahisoa tse etellang pele indastering ea Longi le tsona li tiisa ho ts'epahala ha Hi-MO 7. Hi-MO 7 e netefatsa ts'epo ea eona bophelong bohle ba eona ka meralo e ntlafalitsoeng joalo ka li-wafers tsa boleng bo holimo tsa monocrystalline, pente e ikhethileng ea sele, encapsulation ea module e ntlafalitsoeng. Sistimi ea lifilimi, khokahanyo e nepahetseng ea SMBB e phahameng, le ho ts'epahalla ka mokhoa o phahameng oa mabokose a mateano," moetsi o boletse.

"Ts'ebeliso ea li-platform tsa tlhahiso ea digitalized le taolo ea boleng, haholo-holo theknoloji e bohlale ea ho lemoha AI, e tiisa hape boleng ba sehlahisoa sa Hi-MO 7. Ka hona, Hi-MO 7 e fana ka tiisetso ea matla e sa feteng 0.38%, e tlisang bareki boleng bo matla. le meputso e atlehileng ho feta kamoo ho neng ho lebelletsoe,” e ile ea eketsa.